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WIP: Leveraging Learning Analytics to Explore Elementary Students Collaboration and Affect in Engineering Design Challenges

  • Corey Schimpf
  • , Jutshi Agarwal
  • , Nischal Sunar
  • , Linda Smith
  • , Amanda Thompson
  • , S. Askari Mehdi
  • SUNY Buffalo
  • Explore Interactive, Inc.

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This research work-in-progress paper reports on a proof of concept trial of an augmented reality learning platform that aims to unobtrusively capture elementary students' collaborative actions and affective states. With the growing push to integrate engineering education in K-12 settings, elementary teachers and students face many implementation challenges. In particular, while engineering design projects can serve as a context for developing collaborative skills, younger students might find open-ended projects where working with others who have different views than their own especially difficult. Such projects may also force young students to contend with several emotions. In this space, we propose MindLabs, an augmented reality platform for engaging in integrated science and engineering design projects. In a pilot study 216 elementary students on teams completed a lesson on forces and motions which ended with a two-day design challenge. While students interacted with the system, their collaborative actions and use of the affective state reporting tool were captured. Using learning analytics and more specifically exploratory data visualization, we present three cases that demonstrate positive and negative collaboration dynamics and affect reporting differences. We discuss how the results relate to past research on collaboration dynamics, affect and conflict and how these analytics could support teachers to identify and assist different groups of students. We conclude with future steps for this project.

Original languageEnglish
Title of host publication2024 IEEE Frontiers in Education Conference, FIE 2024 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350351507
DOIs
StatePublished - 2024
Event54th IEEE Frontiers in Education Conference, FIE 2024 - Washington, United States
Duration: Oct 13 2024Oct 16 2024

Publication series

NameProceedings - Frontiers in Education Conference, FIE
ISSN (Print)1539-4565

Conference

Conference54th IEEE Frontiers in Education Conference, FIE 2024
Country/TerritoryUnited States
CityWashington
Period10/13/2410/16/24

Keywords

  • affect and emotion
  • engineering design
  • learning analytics
  • project-based learning

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