TY - GEN
T1 - Voltage Balancing Control with Active Gate Driver for Series Connected SiC MOSFETs
AU - Lee, Inhwan
AU - Yue, Lu
AU - Yao, Xiu
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/9
Y1 - 2019/9
N2 - Silicon carbide (SiC) device is expected to replace silicon (Si) device in many high voltage and power application due to potentially higher switching frequency and voltage capabilities. Even though its potential voltage capability, the highest voltage rating of a single commercial SiC MOSFET is 1.7 kV. An alternative method to achieve higher voltage is a device series connection. However, it causes a voltage unbalance issue during turn-off state that can harm the devices. Therefore, the voltage balancing control (VBC) must be considered in device series connection. In this paper, a VBC method with active gate driver (AGD) is proposed. A gate resistance modulation method with a signal time delay is adopted for dynamic voltage sharing. The proposed method is experimentally verified.
AB - Silicon carbide (SiC) device is expected to replace silicon (Si) device in many high voltage and power application due to potentially higher switching frequency and voltage capabilities. Even though its potential voltage capability, the highest voltage rating of a single commercial SiC MOSFET is 1.7 kV. An alternative method to achieve higher voltage is a device series connection. However, it causes a voltage unbalance issue during turn-off state that can harm the devices. Therefore, the voltage balancing control (VBC) must be considered in device series connection. In this paper, a VBC method with active gate driver (AGD) is proposed. A gate resistance modulation method with a signal time delay is adopted for dynamic voltage sharing. The proposed method is experimentally verified.
KW - Active gate driver
KW - Series connection
KW - Silicon carbide (SiC) MOSFET
KW - Voltage balancing control
KW - Wide bandgap (WBG) device
UR - https://www.scopus.com/pages/publications/85076792460
U2 - 10.1109/ECCE.2019.8912562
DO - 10.1109/ECCE.2019.8912562
M3 - Conference contribution
AN - SCOPUS:85076792460
T3 - 2019 IEEE Energy Conversion Congress and Exposition, ECCE 2019
SP - 3235
EP - 3239
BT - 2019 IEEE Energy Conversion Congress and Exposition, ECCE 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 11th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2019
Y2 - 29 September 2019 through 3 October 2019
ER -