Two-dimensional electrical characterization of ultrashallow source/drain extensions for nanoscale MOSFETs

State-of-the-art semiconductor devices require accurate control of the full two-dimensional dopant distribution. In this work, we report results obtained on 2D electrical characterization of ultra shallow junctions in Si using off axis electron holography to study two-dimensional effects on diffusion. In particular, the effect of a nitride diffusion mask on lateral diffusion of phosphorous is discussed. Retardation of lateral diffusion of P under the nitride diffusion mask is observed and compared to the lateral diffusion of P under an oxide diffusion mask. The ultra shallow junctions for the study were fabricated by a rapid thermal diffusion process from heavily P doped spin-on-dopants into a heavily B doped Si substrate. These shallow junctions are needed for fabricating source/drain extensions in nanoscale MOSFETs. One-dimensional electrical characterization of the junction was carried out to determine the electrical junction depth and compared to the metallurgical junction depth from SIMS analysis.