TY - GEN
T1 - Towards High-Power Multipliers Using Diamond Schottky Barrier Diodes
AU - Konstantinou, Xenofon
AU - Herrera-Rodriguez, Cristian J.
AU - Lai, Junyu
AU - Hardy, Aaron
AU - Albrecht, John D.
AU - Seo, Jung Hun
AU - Muehle, Matthias
AU - Grotjohn, Timothy
AU - Papapolymerou, John
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021
Y1 - 2021
N2 - This work focuses on the unique potential of high-power, high-frequency frequency multipliers using diamond Schottky Barrier Diodes (SBDs). We demonstrate the design, fabrication, and small-signal RF characterization of doublers on single-crystalline diamond (SCD). This is the first attempt to realize a frequency multiplier fully integrated on diamond. The SBDs utilized are developed on a p-/p+ boron-doped SCD wafer. The fabricated structures are compact, occupying an area smaller than 10 mm2 each. Small-signal RF measurements are performed from 50 MHz up to 67 GHz. The results of this initial attempt are very promising for future high-power MMIC multiplier structures for microwave and mm-wave frequencies.
AB - This work focuses on the unique potential of high-power, high-frequency frequency multipliers using diamond Schottky Barrier Diodes (SBDs). We demonstrate the design, fabrication, and small-signal RF characterization of doublers on single-crystalline diamond (SCD). This is the first attempt to realize a frequency multiplier fully integrated on diamond. The SBDs utilized are developed on a p-/p+ boron-doped SCD wafer. The fabricated structures are compact, occupying an area smaller than 10 mm2 each. Small-signal RF measurements are performed from 50 MHz up to 67 GHz. The results of this initial attempt are very promising for future high-power MMIC multiplier structures for microwave and mm-wave frequencies.
KW - Chemical vapor deposition (CVD) diamond
KW - Doubler
KW - High power
KW - Multiplier
KW - Schottky barrier diode (SBD)
KW - Single-crystalline diamond (SCD)
UR - https://www.scopus.com/pages/publications/85123739500
U2 - 10.1109/COMCAS52219.2021.9629034
DO - 10.1109/COMCAS52219.2021.9629034
M3 - Conference contribution
AN - SCOPUS:85123739500
T3 - 2021 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2021
SP - 111
EP - 115
BT - 2021 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2021 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems, COMCAS 2021
Y2 - 1 November 2021 through 3 November 2021
ER -