Abstract
Tin‐lead (60Sn‐40Pb) flake poly(ether sulfone) (PES) composites in which the flakes were partially interconnected and of average thickness 2 μm were prepared by hot pressing molten Sn‐Pb particles in a matrix of PES at a temperature above the melting temperature of Sn‐Pb and above the glass transition temperature of PES. Hot pressing at 240°C and 6.51 Mpa resulted in a 15 vol% Sn‐Pb composite of lower electrical resistivity and higher electromagnetic interference shielding effectiveness than a PES composite containing 15 vol% aluminum flakes that were not formed in‐situ. The electrical properties of the in‐situ PES/Sn‐Pb flake composites were much better than those of PES/Sn‐Pb flake composites were fabricated by hot pressing at 310°C (the manufacturer‐suggested fabrication temperature), though the mechanical properties were not as good.
| Original language | English |
|---|---|
| Pages (from-to) | 361-366 |
| Number of pages | 6 |
| Journal | Polymer Composites |
| Volume | 14 |
| Issue number | 5 |
| DOIs | |
| State | Published - Oct 1993 |
Fingerprint
Dive into the research topics of 'Tin‐Lead flake poly (ether sulfone) composite formed by in‐situ melt processing of tin‐lead particles'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver