Tin-lead flake polyether sulfone composite formed by in-situ melt processing of tin-lead particles

Lin Li; D. D.L. Chung

Tin-lead flake polyether sulfone composite formed by in-situ melt processing of tin-lead particles

Lin Li
, D. D.L. Chung

Department of Mechanical and Aerospace Engineering

SUNY Buffalo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Tin-lead (60Sn-40Pb) flake polyether sulfone (PES) composites in which the flakes were partially interconnected and of average thickness 2 μm were prepared by hot pressing molten Sn-Pb particles in a matrix of PES at a temperature above the melting temperature (T_m) of Sn-Pb but between T_m and T_g of PES. Hot pressing at 240°C and 6.51 MPa resulted in a 15 vol.% Sn-Pb composite of lower electrical resistivity and higher electromagnetic interference shielding effectiveness than a PES composite containing 15 vol.% aluminum flakes that were not formed in-situ. The electrical properties of the in-situ PES/Sn-Pb flake composites were much better than those of PES/Sn-Pb particle composites that were fabricated by hot pressing at 310°C (above the melting temperature of PES), though the mechanical properties were not as good.

Original language	English
Title of host publication	International SAMPE Electronics Conference
Pages	121-130
Number of pages	10
Volume	6
State	Published - 1992
Event	6th International SAMPE Electronics Conference - Baltimore, MD, USA Duration: Jun 22 1992 → Jun 25 1992

Conference

Conference	6th International SAMPE Electronics Conference
City	Baltimore, MD, USA
Period	06/22/92 → 06/25/92

Cite this

@inproceedings{e3d02ba541a144e0b3c3c4e88b273d97,

title = "Tin-lead flake polyether sulfone composite formed by in-situ melt processing of tin-lead particles",

abstract = "Tin-lead (60Sn-40Pb) flake polyether sulfone (PES) composites in which the flakes were partially interconnected and of average thickness 2 μm were prepared by hot pressing molten Sn-Pb particles in a matrix of PES at a temperature above the melting temperature (Tm) of Sn-Pb but between Tm and Tg of PES. Hot pressing at 240°C and 6.51 MPa resulted in a 15 vol.\% Sn-Pb composite of lower electrical resistivity and higher electromagnetic interference shielding effectiveness than a PES composite containing 15 vol.\% aluminum flakes that were not formed in-situ. The electrical properties of the in-situ PES/Sn-Pb flake composites were much better than those of PES/Sn-Pb particle composites that were fabricated by hot pressing at 310°C (above the melting temperature of PES), though the mechanical properties were not as good.",

author = "Lin Li and Chung, \{D. D.L.\}",

year = "1992",

language = "English",

isbn = "0938994654",

volume = "6",

pages = "121--130",

booktitle = "International SAMPE Electronics Conference",

note = "6th International SAMPE Electronics Conference ; Conference date: 22-06-1992 Through 25-06-1992",

}

TY - GEN

T1 - Tin-lead flake polyether sulfone composite formed by in-situ melt processing of tin-lead particles

AU - Li, Lin

AU - Chung, D. D.L.

PY - 1992

Y1 - 1992

N2 - Tin-lead (60Sn-40Pb) flake polyether sulfone (PES) composites in which the flakes were partially interconnected and of average thickness 2 μm were prepared by hot pressing molten Sn-Pb particles in a matrix of PES at a temperature above the melting temperature (Tm) of Sn-Pb but between Tm and Tg of PES. Hot pressing at 240°C and 6.51 MPa resulted in a 15 vol.% Sn-Pb composite of lower electrical resistivity and higher electromagnetic interference shielding effectiveness than a PES composite containing 15 vol.% aluminum flakes that were not formed in-situ. The electrical properties of the in-situ PES/Sn-Pb flake composites were much better than those of PES/Sn-Pb particle composites that were fabricated by hot pressing at 310°C (above the melting temperature of PES), though the mechanical properties were not as good.

AB - Tin-lead (60Sn-40Pb) flake polyether sulfone (PES) composites in which the flakes were partially interconnected and of average thickness 2 μm were prepared by hot pressing molten Sn-Pb particles in a matrix of PES at a temperature above the melting temperature (Tm) of Sn-Pb but between Tm and Tg of PES. Hot pressing at 240°C and 6.51 MPa resulted in a 15 vol.% Sn-Pb composite of lower electrical resistivity and higher electromagnetic interference shielding effectiveness than a PES composite containing 15 vol.% aluminum flakes that were not formed in-situ. The electrical properties of the in-situ PES/Sn-Pb flake composites were much better than those of PES/Sn-Pb particle composites that were fabricated by hot pressing at 310°C (above the melting temperature of PES), though the mechanical properties were not as good.

UR - https://www.scopus.com/pages/publications/0027088066

M3 - Conference contribution

AN - SCOPUS:0027088066

SN - 0938994654

VL - 6

SP - 121

EP - 130

BT - International SAMPE Electronics Conference

T2 - 6th International SAMPE Electronics Conference

Y2 - 22 June 1992 through 25 June 1992

ER -

Tin-lead flake polyether sulfone composite formed by in-situ melt processing of tin-lead particles

Abstract

Conference

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