Abstract
Isotropic, highly resilient and electrically conducting composites in the form of silicone-matrix copper-spring three-dimensional network composites were developed for use as electrical and thermal contact materials. The springs were made from 63 μm diameter copper wires and were coated and interconnected by Sn-Pb solder. In the composites, the springs were long, bent, intersecting and interconnected to one another to form a three-dimensional network. Composites are fabricated by infiltration of a silicone resin into a preform of springs. A volume resistivity of 5 × 10-4 Ω.cm, a contact resistivity with copper of 0.016 Ω.cm2 at ≥ 0.03 MPa, and a permanent set of 0.6% after compression at 0.4 MPa were achieved in a silicone-matrix composite containing 3.1 vol.% Cu springs and 2.9 vol.% solder (i.e., 6.0 vol.% total filler); the volume resistivity was not affected by heating in air at 130-150°C for 7 days, nor by immersion in water for 7 days. The volume resistivity values of composites containing from 4.17 to 6.00 vol.% total filler were equal to 3 times the corresponding calculated values for composites containing unidirectional and continuous fibers, indicating that the filler was indeed a continuous three-dimensional network.
| Original language | English |
|---|---|
| Title of host publication | International SAMPE Electronics Conference |
| Pages | 770-781 |
| Number of pages | 12 |
| Volume | 6 |
| State | Published - 1992 |
| Event | 6th International SAMPE Electronics Conference - Baltimore, MD, USA Duration: Jun 22 1992 → Jun 25 1992 |
Conference
| Conference | 6th International SAMPE Electronics Conference |
|---|---|
| City | Baltimore, MD, USA |
| Period | 06/22/92 → 06/25/92 |
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