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Three-dimensionally interconnected metal spring network in a silicone matrix as a resilient and electrically conducting composite material

  • SUNY Buffalo

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Isotropic, highly resilient and electrically conducting composites in the form of silicone-matrix copper-spring three-dimensional network composites were developed for use as electrical and thermal contact materials. The springs were made from 63 μm diameter copper wires and were coated and interconnected by Sn-Pb solder. In the composites, the springs were long, bent, intersecting and interconnected to one another to form a three-dimensional network. Composites are fabricated by infiltration of a silicone resin into a preform of springs. A volume resistivity of 5 × 10-4 Ω.cm, a contact resistivity with copper of 0.016 Ω.cm2 at ≥ 0.03 MPa, and a permanent set of 0.6% after compression at 0.4 MPa were achieved in a silicone-matrix composite containing 3.1 vol.% Cu springs and 2.9 vol.% solder (i.e., 6.0 vol.% total filler); the volume resistivity was not affected by heating in air at 130-150°C for 7 days, nor by immersion in water for 7 days. The volume resistivity values of composites containing from 4.17 to 6.00 vol.% total filler were equal to 3 times the corresponding calculated values for composites containing unidirectional and continuous fibers, indicating that the filler was indeed a continuous three-dimensional network.

Original languageEnglish
Title of host publicationInternational SAMPE Electronics Conference
Pages770-781
Number of pages12
Volume6
StatePublished - 1992
Event6th International SAMPE Electronics Conference - Baltimore, MD, USA
Duration: Jun 22 1992Jun 25 1992

Conference

Conference6th International SAMPE Electronics Conference
CityBaltimore, MD, USA
Period06/22/9206/25/92

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