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Three-dimensional integrated stretchable electronics

  • Zhenlong Huang
  • , Yifei Hao
  • , Yang Li
  • , Hongjie Hu
  • , Chonghe Wang
  • , Akihiro Nomoto
  • , Taisong Pan
  • , Yue Gu
  • , Yimu Chen
  • , Tianjiao Zhang
  • , Weixin Li
  • , Yusheng Lei
  • , Nam Heon Kim
  • , Chunfeng Wang
  • , Lin Zhang
  • , Jeremy W. Ward
  • , Ayden Maralani
  • , Xiaoshi Li
  • , Michael F. Durstock
  • , Albert Pisano
  • Yuan Lin, Sheng Xu
  • University of California at San Diego
  • University of Electronic Science and Technology of China
  • Tianjin University
  • Zhengzhou University
  • Air Force Research Laboratory

Research output: Contribution to journalArticlepeer-review

553 Scopus citations

Abstract

Stretchable electronics is an emerging technology that creates devices with the ability to conform to nonplanar and dynamic surfaces such as the human body. Current stretchable configurations are constrained to single-layer designs due to limited material processing capabilities in soft electronic systems. Here we report a framework for engineering three-dimensional integrated stretchable electronics by combining strategies in material design and advanced microfabrication. Our three-dimensional devices are built layer by layer through transfer printing pre-designed stretchable circuits on elastomers and creating vertical interconnect accesses using laser ablation and controlled soldering. Our approach enables a higher integration density on stretchable substrates than single-layer approaches and allows new functionalities that would be difficult to implement with conventional single-layer designs. Using this engineering framework, we create a stretchable human–machine interface testbed that is based on a four-layer design and offers eight-channel sensing and Bluetooth data communication capabilities.

Original languageEnglish
Pages (from-to)473-480
Number of pages8
JournalNature Electronics
Volume1
Issue number8
DOIs
StatePublished - Aug 1 2018

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