Skip to main navigation Skip to search Skip to main content

Thin film polycrystalline Si by a novel solution growth technique

  • SUNY Buffalo

Research output: Contribution to journalConference articlepeer-review

5 Scopus citations

Abstract

A solution growth technique has been developed capable of deposition large grain (up to 20-30 μm) Si films at temperatures no higher than 650°C. XRD analysis of the deposited films show a strong (111) preferred orientation, depending on the use of a wetting agent during growth. A well-defined grain structure is seen by SEM examination. Films deposited using an In-Si solution are p-type; those from Sn-Si solutions are n-type. Carrier concentrations range from the low 1016 cm-3 to the mid 1017 cm-3 range. Conductivities as high as .2 (Ωcm)-1 were measured. Hall effect measurements showed hole mobilities as high as approx. 30 cm2V-1s-1. Photoresponse is reduced for films deposited with a wetting agent.

Original languageEnglish
Pages (from-to)1379-1382
Number of pages4
JournalConference Record of the IEEE Photovoltaic Specialists Conference
Volume2
StatePublished - 1994
EventProceedings of the 24th IEEE Photovoltaic Specialists Conference. Part 2 (of 2) - Waikoloa, HI, USA
Duration: Dec 5 1994Dec 9 1994

Fingerprint

Dive into the research topics of 'Thin film polycrystalline Si by a novel solution growth technique'. Together they form a unique fingerprint.

Cite this