Thermomigration induced strain field simulation for microelectronic lead free solder joints

Shidong Li; Mohd F. Abdulhamid; Minghui Lin; Cemal Basaran

doi:10.1115/IMECE2006-13046

Thermomigration induced strain field simulation for microelectronic lead free solder joints

Shidong Li
, Mohd F. Abdulhamid
, Minghui Lin
, Cemal Basaran

Department of Civil, Structural & Environmental Engineering

SUNY Buffalo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

Many factors such as high intensity current, thermal load, shock load, vibration load and etc., can induce the failure in electronic equipment. It is common for electronic equipment to be subjected to a combination of the loads mentioned above simultaneously. In this paper, qualitative finite element simulations of thermomigration induced strain fields in lead free solders are conducted using a fully coupled displacement-diffusion model [1] with nonlinear mechanical material properties. The solutions are discussed and compared to experimental data as well as theoretical developments from literature.

Original language	English
Title of host publication	Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging
Publisher	American Society of Mechanical Engineers (ASME)
ISBN (Print)	0791837904, 9780791837900
DOIs	https://doi.org/10.1115/IMECE2006-13046
State	Published - 2006
Event	2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Chicago, IL, United States Duration: Nov 5 2006 → Nov 10 2006

Publication series

Name	American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
ISSN (Print)	1071-6947

Conference

Conference	2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006
Country/Territory	United States
City	Chicago, IL
Period	11/5/06 → 11/10/06

Access to Document

10.1115/IMECE2006-13046

Cite this

Li, S., Abdulhamid, M. F., Lin, M., & Basaran, C. (2006). Thermomigration induced strain field simulation for microelectronic lead free solder joints. In Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging (American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE2006-13046

Li, Shidong ; Abdulhamid, Mohd F. ; Lin, Minghui et al. / Thermomigration induced strain field simulation for microelectronic lead free solder joints. Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging. American Society of Mechanical Engineers (ASME), 2006. (American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP).

@inproceedings{01ab2560d0634692a27290cca6de587b,

title = "Thermomigration induced strain field simulation for microelectronic lead free solder joints",

abstract = "Many factors such as high intensity current, thermal load, shock load, vibration load and etc., can induce the failure in electronic equipment. It is common for electronic equipment to be subjected to a combination of the loads mentioned above simultaneously. In this paper, qualitative finite element simulations of thermomigration induced strain fields in lead free solders are conducted using a fully coupled displacement-diffusion model [1] with nonlinear mechanical material properties. The solutions are discussed and compared to experimental data as well as theoretical developments from literature.",

author = "Shidong Li and Abdulhamid, \{Mohd F.\} and Minghui Lin and Cemal Basaran",

year = "2006",

doi = "10.1115/IMECE2006-13046",

language = "English",

isbn = "0791837904",

series = "American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP",

publisher = "American Society of Mechanical Engineers (ASME)",

booktitle = "Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging",

address = "United States",

note = "2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 ; Conference date: 05-11-2006 Through 10-11-2006",

}

Li, S, Abdulhamid, MF, Lin, M & Basaran, C 2006, Thermomigration induced strain field simulation for microelectronic lead free solder joints. in Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging. American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, American Society of Mechanical Engineers (ASME), 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006, Chicago, IL, United States, 11/5/06. https://doi.org/10.1115/IMECE2006-13046

Thermomigration induced strain field simulation for microelectronic lead free solder joints. / Li, Shidong; Abdulhamid, Mohd F.; Lin, Minghui et al.
Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging. American Society of Mechanical Engineers (ASME), 2006. (American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Thermomigration induced strain field simulation for microelectronic lead free solder joints

AU - Li, Shidong

AU - Abdulhamid, Mohd F.

AU - Lin, Minghui

AU - Basaran, Cemal

PY - 2006

Y1 - 2006

N2 - Many factors such as high intensity current, thermal load, shock load, vibration load and etc., can induce the failure in electronic equipment. It is common for electronic equipment to be subjected to a combination of the loads mentioned above simultaneously. In this paper, qualitative finite element simulations of thermomigration induced strain fields in lead free solders are conducted using a fully coupled displacement-diffusion model [1] with nonlinear mechanical material properties. The solutions are discussed and compared to experimental data as well as theoretical developments from literature.

AB - Many factors such as high intensity current, thermal load, shock load, vibration load and etc., can induce the failure in electronic equipment. It is common for electronic equipment to be subjected to a combination of the loads mentioned above simultaneously. In this paper, qualitative finite element simulations of thermomigration induced strain fields in lead free solders are conducted using a fully coupled displacement-diffusion model [1] with nonlinear mechanical material properties. The solutions are discussed and compared to experimental data as well as theoretical developments from literature.

UR - https://www.scopus.com/pages/publications/85196496941

U2 - 10.1115/IMECE2006-13046

DO - 10.1115/IMECE2006-13046

M3 - Conference contribution

AN - SCOPUS:85196496941

SN - 0791837904

SN - 9780791837900

T3 - American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

BT - Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging

PB - American Society of Mechanical Engineers (ASME)

T2 - 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006

Y2 - 5 November 2006 through 10 November 2006

ER -

Li S, Abdulhamid MF, Lin M, Basaran C. Thermomigration induced strain field simulation for microelectronic lead free solder joints. In Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging. American Society of Mechanical Engineers (ASME). 2006. (American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP). doi: 10.1115/IMECE2006-13046

Thermomigration induced strain field simulation for microelectronic lead free solder joints

Abstract

Publication series

Conference

Access to Document

Other files and links

Fingerprint

Cite this