Abstract
The thermomigration of flip chip solder joints under current stressing was discussed. It was suggested that the joule heating from the silicon die maintains a great thermal gradient within the solder joint, which triggers thermomigration. The finite element simulation results supported the existence of the the thermal gradient.
| Original language | English |
|---|---|
| Pages (from-to) | 1045-1047 |
| Number of pages | 3 |
| Journal | Applied Physics Letters |
| Volume | 82 |
| Issue number | 7 |
| DOIs | |
| State | Published - Feb 17 2003 |
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