Thermomechanical stress analysis of multi-layered electronic packaging

An accurate estimate of thermal stresses in multilayered microelectronics structures along the bonded interfaces is crucial for design and prediction of delamination-related failures. Compared with a numerical method, analytical closed-form solution can offer a more rapid method to obtain the stresses at the interfaces. An analytical model for ply-level sub-laminate analysis is investigated in this paper. The theory presented treats each layer as a beam-type plate with orthotropic material properties. As an example, the results are shown for a three-layer beam problem with special orthotropic material properties. Analytical model results are compared with the finite element analysis results, as a first order approximation.