Thermoelectric behavior of solder

Voltage can affect the electrical grounding, especially in cases where the heat sink is used for grounding and solder is used as a thermal interface material. Because of the absence of prior work on the thermoelectric effect of solder, an attempt was made to study this phenomenon. Thermopower measurement was performed on rectangular samples of 63Sn-37Pb eutectic alloy (V-LEE). Curves during heating and cooling overlapped, indicating reversibility. Slope increased with increasing temperature difference. The absolute thermoelectric power increased in magnitude as the temperature difference increased.