TY - GEN
T1 - Thermal Stress Analysis of Multi-layered Microelectronic Packaging
AU - Wen, Yujun
AU - Basaran, Cemal
AU - Dishongh, Terry
AU - Searls, Damion
PY - 2001
Y1 - 2001
N2 - An accurate estimate of thermal stresses in multilayered microelectronics structures along the bonded interfaces is crucial for design and prediction of delamination-related failures. Compared with numerical method, analytical solution can offer a more rapid method to obtain the stresses at the interface. An analytical model for ply-level sub-laminate analysis is investigated in this paper. The presented theory treats each layer as a beam-type plate with appropriate interface and surface conditions. As an example, the results are shown for the three-layer beam problem with special orthotropic material properties. Analytical model results are compared with the finite element analyis results.
AB - An accurate estimate of thermal stresses in multilayered microelectronics structures along the bonded interfaces is crucial for design and prediction of delamination-related failures. Compared with numerical method, analytical solution can offer a more rapid method to obtain the stresses at the interface. An analytical model for ply-level sub-laminate analysis is investigated in this paper. The presented theory treats each layer as a beam-type plate with appropriate interface and surface conditions. As an example, the results are shown for the three-layer beam problem with special orthotropic material properties. Analytical model results are compared with the finite element analyis results.
UR - https://www.scopus.com/pages/publications/0346308518
M3 - Conference contribution
AN - SCOPUS:0346308518
SN - 0791835405
SN - 9780791835401
T3 - Advances in Electronic Packaging
SP - 449
EP - 460
BT - Advances in Electronic Packaging; Electrical Design, Simulation, and Test, Mems, Materials and Processing, Modeling and Characterization
T2 - Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition
Y2 - 8 July 2001 through 13 July 2001
ER -