Abstract
Thermal interface pastes based on silicone, lithium doped polyethylene glycol (PEG), and sodium silicate were evaluated in their performance before and after heating up to 120°C. The thermal contact conductance of any of the pastes between copper disks decreased after heating, such that the fractional decrease was less for the silicone-based paste than the PEG-based and sodium-silicate-based pastes. Nevertheless, the conductance was lower for the silicone-based paste than the other pastes both before and after heating up to 100 cycles.
| Original language | English |
|---|---|
| Pages (from-to) | 309-315 |
| Number of pages | 7 |
| Journal | Journal of Electronic Packaging |
| Volume | 123 |
| Issue number | 3 |
| DOIs | |
| State | Published - Sep 2001 |
Keywords
- Boron nitride
- Composite
- Polyethylene glycol
- Silicone
- Sodium silicate
- Thermal conductance
- Thermal contact
- Thermal interface
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