Thermal Interface Materials

D. D.L. Chung

doi:10.1007/s11664-019-07732-3

Thermal Interface Materials

D. D.L. Chung

Department of Mechanical and Aerospace Engineering

Research output: Contribution to journal › Editorial

20 Scopus citations

Abstract

Cooling is critically needed for reliability, power and further miniaturization of microelectronics. Heat sinks are obviously important for heat dissipation. However, thermal interface materials (TIMs) are needed to improve thermal contacts, such as the thermal contact between a heat source (e.g., a microprocessor) and a heat sink. This commentary is directed at clarifying some misconceptions related to the design and testing of TIMs.

Original language	English
Pages (from-to)	268-270
Number of pages	3
Journal	Journal of Electronic Materials
Volume	49
Issue number	1
DOIs	https://doi.org/10.1007/s11664-019-07732-3
State	Published - Jan 1 2020

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10.1007/s11664-019-07732-3

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title = "Thermal Interface Materials",

abstract = "Cooling is critically needed for reliability, power and further miniaturization of microelectronics. Heat sinks are obviously important for heat dissipation. However, thermal interface materials (TIMs) are needed to improve thermal contacts, such as the thermal contact between a heat source (e.g., a microprocessor) and a heat sink. This commentary is directed at clarifying some misconceptions related to the design and testing of TIMs.",

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AB - Cooling is critically needed for reliability, power and further miniaturization of microelectronics. Heat sinks are obviously important for heat dissipation. However, thermal interface materials (TIMs) are needed to improve thermal contacts, such as the thermal contact between a heat source (e.g., a microprocessor) and a heat sink. This commentary is directed at clarifying some misconceptions related to the design and testing of TIMs.

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Thermal Interface Materials

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