Abstract
Thermal interface materials for facilitating heat transfer by conduction across two adjacent surfaces are reviewed. They include thermal fluids and pastes, solders, phase change materials (PCMs), and resilient thermal conductors.
| Original language | English |
|---|---|
| Pages (from-to) | 56-59 |
| Number of pages | 4 |
| Journal | Journal of Materials Engineering and Performance |
| Volume | 10 |
| Issue number | 1 |
| DOIs | |
| State | Published - Feb 2001 |
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