@inproceedings{4b95bf44dfe54052a2c9f005855f6063,
title = "Thermal and Structural Analysis of a Press-Pack Ga2O3 Schottky Diode",
abstract = "Ga2O3 is an ultrawide bandgap material with the potential to replace SiC in Power Electronic applications. However, wide-scale adoption is hampered by its poor thermal conductivity. Conventional cooling techniques will be insufficient in cooling Ga2O3 devices. Double-side cooling is an efficient technique to achieve lower temperatures. Press-Pack packaging ensures electrical contact through pressure. It is inherently designed to support double-side cooling. In this paper, a Press-Pack package was designed to cool a Ga2O3 Schottky diode. Finite Element Analysis simulations were conducted in Ansys Icepak and Mechanical to evaluate its thermal and structural performance. Multiple design variations, heat losses, and cooling techniques were tested.",
keywords = "Double-side cooling, Gallium Oxide, Press-Pack package",
author = "Arindam Sircar and Xiu Yao",
note = "Publisher Copyright: {\textcopyright} 2025 IEEE.; 17th Annual IEEE Energy Conversion Conference Congress and Exposition, ECCE 2025 ; Conference date: 19-10-2025 Through 23-10-2025",
year = "2025",
doi = "10.1109/ECCE58356.2025.11260395",
language = "English",
series = "2025 IEEE Energy Conversion Conference Congress and Exposition, ECCE 2025",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2025 IEEE Energy Conversion Conference Congress and Exposition, ECCE 2025",
address = "United States",
}