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Tenpura: A General Transient Fault Evaluation and Scope Narrowing Platform for Ultra-fast Reliability Analysis

  • Quan Cheng
  • , Huizi Zhang
  • , Chien Hsing Liang
  • , Mingtao Zhang
  • , Jing Jia Liou
  • , Jinjun Xiong
  • , Longyang Lin
  • , Masanori Hashimoto
  • Kyoto University
  • Southern University of Science and Technology
  • National Tsing Hua University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

For reliability-critical silicon systems, transient errors caused by cosmic rays necessitate comprehensive and efficient reliability analysis before product deployment. Fault injection (FI) serves as a cost-effective alternative to expensive irradiation experiments for evaluating system robustness. However, simulation-based FI is constrained by the performance of the underlying hardware platform, making it impractical for large-scale designs, where achieving high fault coverage can take months or even years. Furthermore, most transient errors have no impact on system functionality, and filtering out these insignificant errors in advance can significantly enhance the efficiency of reliability analysis. To address these challenges, we propose Tenpura, a fault evaluation platform designed for ultra-fast reliability analysis. In Tenpura, a transient fault scope narrowing method is introduced to narrow the FI scope via the proposed scan-based activity tracing flow, further optimizing fault analysis and improving overall efficiency. By leveraging FPGA emulation and scan chain-based fault analysis at the pre-silicon stage, Tenpura achieves high-efficiency fault reduction (88.49-96.26% across three design under tests (DUTs) including RISC-V cores and NVDLA-based AI accelerator) within one month, delivering over an order of magnitude faster fault analysis compared to SOTA methods.

Original languageEnglish
Title of host publication2025 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2025 - Conference Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798331515607
DOIs
StatePublished - 2025
Event44th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2025 - Munich, Germany
Duration: Oct 26 2025Oct 30 2025

Publication series

NameIEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
ISSN (Print)1092-3152

Conference

Conference44th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2025
Country/TerritoryGermany
CityMunich
Period10/26/2510/30/25

Keywords

  • fault injection
  • reliability analysis
  • scan chain
  • scope narrowing

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