TEM study of MOCVD grown InSb/GaAs heterostructures with and without TMIn predeposited layers

High quality InSb epilayers were grown on GaAs substrates by metal organic chemical vapor deposition using a two-step growth procedure involving trimethal indium (TMIn) predeposition. From transmission electron microscopy studies, we found that an interdiffusion layer of thickness of 10 angstrom forms at the interface when the substrate is exposed to TMIn for approximately 6 secs prior to the growth of the InSb films. Hall mobilities up to approx. 52,000 cm²/V-s were obtained at 300 K on a 2.1-μm-thick InSb heteroepitaxial film. In contrast, samples without TMIn predeposition showed polycrystallinity of the InSb films grown on single crystalline GaAs substrates. The effect of TMIn predeposition is to minimize the misorientation of the grains, suppress the polycrystallinity, decrease the density of threading dislocations, and increase the electron mobilities in the films. However, we found that too much TMIn predeposition gives rise to an intermixing layer at the InSb/GaAs interface which deteriorates the film quality. Details of the effect of the TMIn predeposition on the microstructure of InSb/GaAs with different predeposition times (zero, 6, and 12 secs) are discussed.