Abstract
The sequence of intermetallic nucleation at the interface in aluminum copper thin-film couples is described. Using electron microdiffraction, CuAl//2 was identified as the first intermetallic to nucleate at 200 degree C, followed by CuAl and Cu//4Al//3. Preliminary results on a possible orientation relationship between the CuAl//2 and copper are included.
| Original language | English |
|---|---|
| Pages (from-to) | 157-160 |
| Number of pages | 4 |
| Journal | Annual Proceedings - Reliability Physics (Symposium) |
| Volume | 1 |
| State | Published - 1980 |
| Event | Unknown conference - Cannes, Fr Duration: Sep 22 1980 → Sep 26 1980 |
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