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Submicron nickel filaments made by electroplating carbon filaments as a new filler material for electromagnetic interference shielding

  • SUNY Buffalo

Research output: Contribution to journalArticlepeer-review

43 Scopus citations

Abstract

Short nickel filaments of diam 0.4 μm and containing 94 vol% Ni and 6 vol% C were fabricated by electroplating with nickel 0.1 μm diam catalytically grown carbon filaments. The use of these filaments in polyether sulfone in amounts of 3, 7,13, and 19 vol% gave composites with electromagnetic interference shielding effectiveness at 1-2 GHz of 42,87,84, and 92 dB, respectively, compared to a value of 90 dB for solid copper. Less shielding was attained when 0.1 μm diam carbon filaments or 2 or 20 μm diam nickel fibers were used instead.

Original languageEnglish
Pages (from-to)107-113
Number of pages7
JournalJournal of Electronic Materials
Volume24
Issue number2
DOIs
StatePublished - Feb 1995

Keywords

  • Composites
  • electromagnetic interference
  • fibers
  • filaments
  • nickel
  • shielding

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