@inproceedings{23247c95e4c6485e84169bed0e02aa8e,
title = "Simulating electromigration and thermomigration in power electronics packaging",
abstract = "Electromigration (EM) and thermomigration (TM) are processes of mass transport which are critical reliability issue for next generation powerelectronics. The purpose of this project is to study influence of low temperature on EM and TM interaction. In this paper, a model for EM and TM process is proposed and has been implemented in finite element method for computer simulations. The governing equations include mass conservation, force equilibrium, heat transfer, and electricity conduction equations. A damage evolution model based on thermodynamics is introduced to evaluate the degradation in solder joints subjected to high current densities and high temperature gradients. The results are compared with experimental data to validate the model.",
keywords = "Damage mechanics, Electromigration, High power, Power electronics packaging, Thermomigration",
author = "Shidong Li and Abdulhamid, \{Mohd F.\} and Cemal Basaran",
year = "2008",
language = "English",
isbn = "9781622763603",
series = "Grand Challenges in Modeling and Simulation Symposium 2008, GCMS 2008, Part of the 2008 Summer Simulation Multiconference, SummerSim 2008",
pages = "165--171",
booktitle = "Grand Challenges in Modeling and Simulation Symposium 2008, GCMS 2008, Part of the 2008 Summer Simulation Multiconference, SummerSim 2008",
note = "Grand Challenges in Modeling and Simulation Symposium 2008, GCMS 2008, Part of the 2008 Summer Simulation Multiconference, SummerSim 2008 ; Conference date: 16-06-2008 Through 19-06-2008",
}