Silver particle carbon-matrix composites as thick films for electrical applications

Yuan Chan Hsu; D. D.L. Chung

doi:10.1007/s11664-007-0187-4

Silver particle carbon-matrix composites as thick films for electrical applications

Yuan Chan Hsu
, D. D.L. Chung

Department of Mechanical and Aerospace Engineering

SUNY Buffalo

Research output: Contribution to journal › Article › peer-review

6 Scopus citations

Abstract

Silver particle (3 μm) carbon-matrix composites in the form of thick films (around 100 μm thick) on alumina, as prepared from pastes comprising silver and mesophase pitch particles (14 μm), have been attained. The films on alumina were fired at 650°C in nitrogen to convert pitch to carbon. The volume electrical resistivity attained ranged from 10 ^-5 Ω cm to 10 ⁴ Ω cm, depending on the silver volume fraction. The percolation threshold was 12 vol% silver.

Original language	English
Pages (from-to)	1188-1192
Number of pages	5
Journal	Journal of Electronic Materials
Volume	36
Issue number	9
DOIs	https://doi.org/10.1007/s11664-007-0187-4
State	Published - Sep 2007

Keywords

Carbon
Composite
Electrical resistivity
Silver
Thick film

Access to Document

10.1007/s11664-007-0187-4

Cite this

@article{056f4f1c11cb48e2b8ab52860eaaddfa,

title = "Silver particle carbon-matrix composites as thick films for electrical applications",

abstract = "Silver particle (3 μm) carbon-matrix composites in the form of thick films (around 100 μm thick) on alumina, as prepared from pastes comprising silver and mesophase pitch particles (14 μm), have been attained. The films on alumina were fired at 650°C in nitrogen to convert pitch to carbon. The volume electrical resistivity attained ranged from 10 -5 Ω cm to 10 4 Ω cm, depending on the silver volume fraction. The percolation threshold was 12 vol\% silver.",

keywords = "Carbon, Composite, Electrical resistivity, Silver, Thick film",

author = "Hsu, \{Yuan Chan\} and Chung, \{D. D.L.\}",

year = "2007",

month = sep,

doi = "10.1007/s11664-007-0187-4",

language = "English",

volume = "36",

pages = "1188--1192",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "9",

}

TY - JOUR

T1 - Silver particle carbon-matrix composites as thick films for electrical applications

AU - Hsu, Yuan Chan

AU - Chung, D. D.L.

PY - 2007/9

Y1 - 2007/9

N2 - Silver particle (3 μm) carbon-matrix composites in the form of thick films (around 100 μm thick) on alumina, as prepared from pastes comprising silver and mesophase pitch particles (14 μm), have been attained. The films on alumina were fired at 650°C in nitrogen to convert pitch to carbon. The volume electrical resistivity attained ranged from 10 -5 Ω cm to 10 4 Ω cm, depending on the silver volume fraction. The percolation threshold was 12 vol% silver.

AB - Silver particle (3 μm) carbon-matrix composites in the form of thick films (around 100 μm thick) on alumina, as prepared from pastes comprising silver and mesophase pitch particles (14 μm), have been attained. The films on alumina were fired at 650°C in nitrogen to convert pitch to carbon. The volume electrical resistivity attained ranged from 10 -5 Ω cm to 10 4 Ω cm, depending on the silver volume fraction. The percolation threshold was 12 vol% silver.

KW - Carbon

KW - Composite

KW - Electrical resistivity

KW - Silver

KW - Thick film

UR - https://www.scopus.com/pages/publications/34548254488

U2 - 10.1007/s11664-007-0187-4

DO - 10.1007/s11664-007-0187-4

M3 - Article

AN - SCOPUS:34548254488

SN - 0361-5235

VL - 36

SP - 1188

EP - 1192

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 9

ER -

Silver particle carbon-matrix composites as thick films for electrical applications

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Cite this