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Si film growth by supercooling of a molten Si alloy film

  • SUNY Buffalo

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

A method is described for the deposition of large-grain polysilicon films at low substrate temperatures. This technique uses precipitation from a thin molten prelayer of Si-Au or Si-Au which is supersaturated with Si from a DC magnetron sputter gun. Typical growth temperatures are 600 °C for the Si-Al layer, and 500 °C for the Si-Au layer. Growth rates of 6 μm/hr have been achieved, though higher rates seem possible. Films of 20 μm thickness and grain size up to several hundred μm have been grown on SiO2 and sheet Mo substrates using Au and Al as the `solvent' metals. The proposed model for film growth was confirmed by cross-section EDS studies of the film/substrate interface. Film crystallinity was confirmed by etching studies, X-ray diffraction, and selected area diffraction. Preferential nucleation has been achieved using a patterned silicide forming metal (Cr,Ni) on RuO2 coated oxidized wafer. A loss mechanism of the solvent metal during growth was observed.

Original languageEnglish
Title of host publicationMaterials Research Society Symposium Proceedings
PublisherPubl by Materials Research Society
Pages671-677
Number of pages7
ISBN (Print)1558991786
StatePublished - 1993
EventProceedings of the Second Symposium on Dynamics in Small Confining Systems - Boston, MA, USA
Duration: Nov 30 1992Dec 4 1992

Publication series

NameMaterials Research Society Symposium Proceedings
Volume283
ISSN (Print)0272-9172

Conference

ConferenceProceedings of the Second Symposium on Dynamics in Small Confining Systems
CityBoston, MA, USA
Period11/30/9212/4/92

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