Abstract
Resilient metal spring silicone-matrix conducting composites for separable interconnections in electronics were fabricated by the impregnation of silicone into a preform comprising randomly oriented C-shaped Cu-Be springs and a small proportion of Sn-Pb solder, which served to connect the springs at some of their intersections. Composites containing 6.1-9.8 vol.% total filler exhibited volume electrical resistivity 0.5-1.0 mΩ.cm and contact resistivity (with copper) 11-17 mΩ.cm2. A compressive stress of about 30 kPa was needed for the low contact resistivity to be reached. The volume 17-26% and the contact resistivity increased by 5% after heating in air at 130-150°C for seven days. Composites containing <9 vol.% total filler showed no stress relaxation for seven days at 6.0% strain.
| Original language | English |
|---|---|
| Pages (from-to) | 641-647 |
| Number of pages | 7 |
| Journal | Journal of Electronic Materials |
| Volume | 23 |
| Issue number | 7 |
| DOIs | |
| State | Published - Jul 1994 |
Keywords
- composite materials
- Contact electrical resistivity
- copper springs
- increased by electrical resistivity
- solder
- three-dimensional interconnected network silicone matrix
- volume electrical resistivity
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