@inproceedings{9eeb9a44b72a4eb7ba09fec053e7ded5,
title = "Reliability of solder joints under electrical stressing - Strain evolution of solder joints",
abstract = "Damage mechanics of solder interconnects under electrical stressing is an important reliability issue for next generation power electronic packaging as well as for future IC packaging. The high electrical stressing in solder joints leads to electromigration and thus could not be ignored. In this paper, the state-of-the-art research on electromigration in solder joints is reviewed. An experimental electromigration study on solder joints is conducted and results are reported in this paper. The strain field in the solder joints under electrical stressing is measured with Moire Interferometry technique.",
keywords = "Capacitive sensors, Electric variables measurement, Electromigration, Electronics packaging, Integrated circuit packaging, Lead, Power electronics, Soldering, Strain measurement, Stress measurement",
author = "Hua Ye and C. Basaran and D. Hopkins and A. Cartwright",
note = "Publisher Copyright: {\textcopyright} 2002 IEEE.; 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 ; Conference date: 30-05-2002 Through 01-06-2002",
year = "2002",
doi = "10.1109/ITHERM.2002.1012558",
language = "English",
series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",
publisher = "IEEE Computer Society",
pages = "946--952",
editor = "Sammakia, \{Bahgat G.\} and Joshi, \{Yogendra K.\} and Ganesh Subbarayan and Amon, \{Cristina H.\} and Koneru Ramakrishna and Sathe, \{Sanjeev B.\}",
booktitle = "ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems",
address = "United States",
}