Abstract
The inelastic behavior of solder joints of ball grid array (BGA) is discussed. The role of the dynamic loading to the fatigue life of the solder joints was also studied. The results showed that the not only all vibration-induced strains are elastic, but also vibration can cause significant inelastic strains.
| Original language | English |
|---|---|
| Pages | 47-56 |
| Number of pages | 10 |
| Volume | 11 |
| No | 7 |
| Specialist publication | Advanced Packaging |
| State | Published - Jul 2002 |
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