Abstract
The development of transferrable free-standing semiconductor materials and their heterogeneous integration to arbitrary substrates open up new possibilities in improving device performance, exploring nonconventional manufacturing approaches, and offering a pathway to soft, conformal, and flexible electronics. In this work, flexible AlGaN/GaN high-electron mobility transistors (HEMTs) are demonstrated, which are transfer-printed from AlGaN/GaN on insulator to a flexible substrate using a novel releasing strategy based on the fast, facile, and reliable transfer process. Flexible AlGaN/GaN HEMTs possess good electrical performance such as the maximum saturated drain current density and transconductance of 110 mA mm−1 and 42.5 mS mm−1, respectively. Moreover, a significant piezoelectric behavior is observed when the device is under strain, resulting from the piezoelectric-induced polarization at the heterostructure interface. Owing to an additional strain-induced piezoelectric effect by the mechanical bending, the performance of AlGaN/GaN HEMT can be further improved. The results demonstrate that the device has great potential in applications for the next-generation flexible electronics, such as wearable systems, intelligent microinductor systems, and smart systems that can sense or feedback external mechanical stimuli.
| Original language | English |
|---|---|
| Article number | 2100652 |
| Journal | Advanced Electronic Materials |
| Volume | 8 |
| Issue number | 2 |
| DOIs | |
| State | Published - Feb 2022 |
Keywords
- AlGaN/GaN high-electron mobility transistors
- flexible electronics
- piezoelectric effect
- self-heating effect
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