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Record high current density and low contact resistance in MoS2 FETs by ion doping

  • Sara Fathipour
  • , Hua Min Li
  • , Maja Remskar
  • , Lingyen Yeh
  • , Wilman Tsai
  • , Yuming Lin
  • , Susan Fullerton-Shirey
  • , Alan Seabaugh
  • University of Notre Dame
  • Jožef Stefan Institute
  • Taiwan Semiconductor Manufacturing Company
  • University of Pittsburgh

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

8 Scopus citations

Abstract

Record high current density of 300 μA/μm with low contact resistance of 200 Ω μm and a channel length of 0.8 μm at a drain-source bias of 1.6 V has been achieved for the first time in MoS2 field-effect transistors (FETs) grown by chemical vapor transport. The low contact resistance is achieved using a polyethylene-oxide cesium-perchlorate solid polymer ion conductor formed by drop casting. The charged ions are placed into position over the channel by the application of a bias to a side gate and then locked into place by lowering the temperature. A weak temperature dependence of the drain current after ion doping indicates that transport in the Schottky contacts is dominated by tunneling.

Original languageEnglish
Title of host publication2016 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781467394789
DOIs
StatePublished - May 27 2016
EventInternational Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2016 - Hsinchu, Taiwan, Province of China
Duration: Apr 25 2016Apr 27 2016

Publication series

Name2016 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2016

Conference

ConferenceInternational Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2016
Country/TerritoryTaiwan, Province of China
CityHsinchu
Period04/25/1604/27/16

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