TY - GEN
T1 - Plastic Deformation and Measurement of Young's Modulus for Ph/Sn Solders
AU - Jiang, J.
AU - Basaran, C.
PY - 2001
Y1 - 2001
N2 - In this paper, the deformation of the Pb/Sn solders during the thermo-mechanical loading is discussed on the grain size level. Two methods of measuring the Young's Modulus of the Pb/Sn solders are presented using a Nano-Indenter testing system. The results of the test are analyzed and results show that the deformation of the Pb/Sn solders during the thermo-mechanical loading is dominated by visco-plasticity instead of plasticity.
AB - In this paper, the deformation of the Pb/Sn solders during the thermo-mechanical loading is discussed on the grain size level. Two methods of measuring the Young's Modulus of the Pb/Sn solders are presented using a Nano-Indenter testing system. The results of the test are analyzed and results show that the deformation of the Pb/Sn solders during the thermo-mechanical loading is dominated by visco-plasticity instead of plasticity.
UR - https://www.scopus.com/pages/publications/0348198998
M3 - Conference contribution
AN - SCOPUS:0348198998
SN - 0791835405
SN - 9780791835401
T3 - Advances in Electronic Packaging
SP - 1285
EP - 1296
BT - Advances in Electronic Packaging; Thermal Manegement Reliability
T2 - Pacific Rim/International , Intersociety Electronic Packaging Technical/Business Conference and Exhibition
Y2 - 8 July 2001 through 13 July 2001
ER -