NEMI recommends standard test methods to assess propensity for tin whisker growth

The National Electronics Manufacturing Initiative (NEMI) developed the Tin Whisker Accelerated Test Project in 2001 for identifying an accelerated test method for whiskering. The team also discussed theories behind whisker formation to compare test methods to whisker growth mechanism and fundamentals. A separate project, called the Tin Whisker Modeling Project, was formed to evaluate different whisker growth theories. The Tin Whisker Accelerated Test Project has evaluated four principal test methods that are storage at ambient office conditions, storage at high relative humidity, and air-to-air temperature cycling. NEMI recommends three test methods, including two storage conditions and one temperature cycling condition, to evaluate the ability of Sn-based plating finishes to grow whiskers. NEMI is also collaborating with the Japan Electronics & Information Technology Industries Association (JEITA) and a European semiconductor consortium (E3) to form unified whisker test methods.