TY - GEN
T1 - Modeling and Simulating Thermomigration in Power Electronics
AU - Basaran, Cemal
AU - Li, Shidong
N1 - Publisher Copyright:
© 2009 Grand Challenges in Modeling and Simulation Symposium 2009, GCMS 2009 - Part of the 2009 Summer Simulation Multiconference, SummerSim 2009. All rights reserved.
PY - 2009
Y1 - 2009
N2 - Miniaturization of electronics to nanoscale leads to significantly higher current density levels and larger thermal gradients in electronics packaging. Laboratory test data show that thermomigration plays a significant role in high current density induced failure in solder joints and interconnects. In this paper, a computational damage mechanics model for thermomigration process is proposed and implemented in finite element method. This model is based on thermodynamics and formulated by continuum mechanics equations, mass transport principals and heat transfer equations. A damage evolution model using entropy production rate as a metric is utilized to evaluate the degradation in solder joints subjected to high temperature gradients.
AB - Miniaturization of electronics to nanoscale leads to significantly higher current density levels and larger thermal gradients in electronics packaging. Laboratory test data show that thermomigration plays a significant role in high current density induced failure in solder joints and interconnects. In this paper, a computational damage mechanics model for thermomigration process is proposed and implemented in finite element method. This model is based on thermodynamics and formulated by continuum mechanics equations, mass transport principals and heat transfer equations. A damage evolution model using entropy production rate as a metric is utilized to evaluate the degradation in solder joints subjected to high temperature gradients.
KW - Electromigration, Damage Mechanics
KW - Power Electronics Packaging, Nanoelectronics
KW - Solder Joint Reliability
KW - Thermomigration
UR - https://www.scopus.com/pages/publications/85184807053
M3 - Conference contribution
AN - SCOPUS:85184807053
T3 - Grand Challenges in Modeling and Simulation Symposium 2009, GCMS 2009 - Part of the 2009 Summer Simulation Multiconference, SummerSim 2009
SP - 142
EP - 150
BT - Grand Challenges in Modeling and Simulation Symposium 2009, GCMS 2009 - Part of the 2009 Summer Simulation Multiconference, SummerSim 2009
PB - Society of Modeling and Simulation
T2 - 2009 Grand Challenges in Modeling and Simulation Symposium, GCMS 2009
Y2 - 13 July 2009 through 16 July 2009
ER -