Mechanical implications of high current densities in flip chip solder joints

Hua Ye; Cemal Basaran; Douglas Hopkins

doi:10.1115/IMECE2002-33650

Mechanical implications of high current densities in flip chip solder joints

Hua Ye
, Cemal Basaran
, Douglas Hopkins

Department of Civil, Structural & Environmental Engineering

SUNY Buffalo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

The electromigration damage in flip chip solder joints of eutectic SnPb was studied under current stressing at room temperature with the current density about 1.3×10⁴A/cm². The diameter of the solder joints was about 140 m. The mass accumulation near anode side and void nucleation near cathode were observed during current stressing. The nano-indentation test was first time done on solder joints for electromigration test. Surface marker movement was used to measure the atomic flux driven by electromigration and to calculate the product of effective charge number and diffusivity, DxZ*, of the solder at room temperature. The effective charge number can be extracted with the solder diffusivity at room temperature known.

Original language	English
Title of host publication	Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
Publisher	American Society of Mechanical Engineers (ASME)
Pages	477-483
Number of pages	7
ISBN (Print)	0791836487, 9780791836484
DOIs	https://doi.org/10.1115/IMECE2002-33650
State	Published - 2002

Publication series

Name	ASME International Mechanical Engineering Congress and Exposition, Proceedings

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10.1115/IMECE2002-33650

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Ye, H., Basaran, C., & Hopkins, D. (2002). Mechanical implications of high current densities in flip chip solder joints. In Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology (pp. 477-483). (ASME International Mechanical Engineering Congress and Exposition, Proceedings). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE2002-33650

Ye, Hua ; Basaran, Cemal ; Hopkins, Douglas. / Mechanical implications of high current densities in flip chip solder joints. Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. American Society of Mechanical Engineers (ASME), 2002. pp. 477-483 (ASME International Mechanical Engineering Congress and Exposition, Proceedings).

@inproceedings{3cc44f2c256c4fc59851d0aaf4111d37,

title = "Mechanical implications of high current densities in flip chip solder joints",

abstract = "The electromigration damage in flip chip solder joints of eutectic SnPb was studied under current stressing at room temperature with the current density about 1.3×104A/cm2. The diameter of the solder joints was about 140 m. The mass accumulation near anode side and void nucleation near cathode were observed during current stressing. The nano-indentation test was first time done on solder joints for electromigration test. Surface marker movement was used to measure the atomic flux driven by electromigration and to calculate the product of effective charge number and diffusivity, DxZ*, of the solder at room temperature. The effective charge number can be extracted with the solder diffusivity at room temperature known.",

author = "Hua Ye and Cemal Basaran and Douglas Hopkins",

year = "2002",

doi = "10.1115/IMECE2002-33650",

language = "English",

isbn = "0791836487",

series = "ASME International Mechanical Engineering Congress and Exposition, Proceedings",

publisher = "American Society of Mechanical Engineers (ASME)",

pages = "477--483",

booktitle = "Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology",

address = "United States",

}

Ye, H, Basaran, C & Hopkins, D 2002, Mechanical implications of high current densities in flip chip solder joints. in Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. ASME International Mechanical Engineering Congress and Exposition, Proceedings, American Society of Mechanical Engineers (ASME), pp. 477-483. https://doi.org/10.1115/IMECE2002-33650

Mechanical implications of high current densities in flip chip solder joints. / Ye, Hua; Basaran, Cemal; Hopkins, Douglas.
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. American Society of Mechanical Engineers (ASME), 2002. p. 477-483 (ASME International Mechanical Engineering Congress and Exposition, Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Mechanical implications of high current densities in flip chip solder joints

AU - Ye, Hua

AU - Basaran, Cemal

AU - Hopkins, Douglas

PY - 2002

Y1 - 2002

N2 - The electromigration damage in flip chip solder joints of eutectic SnPb was studied under current stressing at room temperature with the current density about 1.3×104A/cm2. The diameter of the solder joints was about 140 m. The mass accumulation near anode side and void nucleation near cathode were observed during current stressing. The nano-indentation test was first time done on solder joints for electromigration test. Surface marker movement was used to measure the atomic flux driven by electromigration and to calculate the product of effective charge number and diffusivity, DxZ*, of the solder at room temperature. The effective charge number can be extracted with the solder diffusivity at room temperature known.

AB - The electromigration damage in flip chip solder joints of eutectic SnPb was studied under current stressing at room temperature with the current density about 1.3×104A/cm2. The diameter of the solder joints was about 140 m. The mass accumulation near anode side and void nucleation near cathode were observed during current stressing. The nano-indentation test was first time done on solder joints for electromigration test. Surface marker movement was used to measure the atomic flux driven by electromigration and to calculate the product of effective charge number and diffusivity, DxZ*, of the solder at room temperature. The effective charge number can be extracted with the solder diffusivity at room temperature known.

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DO - 10.1115/IMECE2002-33650

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AN - SCOPUS:78249275229

SN - 0791836487

SN - 9780791836484

T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings

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BT - Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology

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ER -

Ye H, Basaran C, Hopkins D. Mechanical implications of high current densities in flip chip solder joints. In Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. American Society of Mechanical Engineers (ASME). 2002. p. 477-483. (ASME International Mechanical Engineering Congress and Exposition, Proceedings). doi: 10.1115/IMECE2002-33650

Mechanical implications of high current densities in flip chip solder joints

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