@inproceedings{6140542beebb4892a18160f8e41b973f,
title = "Mean time to failure of SnAgCuNi solder joints under DC",
abstract = "Electromigration time to failure and electrical resistivity of 95.5\%Sn-1.5\%Ag-0.5\%Cu-0.03W\%Ni (SACN) microelectronics solder joints have been investigated experimentally. A Black's type electromigration time to failure equation is developed to describe the time to failure versus current density and temperature. The activation energy over the range of 83°C∼174°C is measured to be 0.77±0.12eV, and the current density exponent is found to be (8.60±1.65). It is also shown that the most commonly used Black's electromigration time to failure equation cannot be used for solder joints.",
keywords = "Electromigration, lead-free solder joints, resistance evolution, solder joint resistance, time to failure",
author = "Cemal Basaran and Shidong Li and Hopkins, \{Douglas C.\} and Wei Yao",
year = "2012",
doi = "10.1109/ITHERM.2012.6231474",
language = "English",
isbn = "9781424495320",
series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",
pages = "518--520",
booktitle = "Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012",
note = "13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012 ; Conference date: 30-05-2012 Through 01-06-2012",
}