Abstract
The increase in operating voltage levels of power modules due to the adoption of wide bandgap semiconductor materials increases the risk of insulation breakdown and partial discharge. Modeling direct-bonded copper (DBC) and evaluating its electric field distribution is an important step for power module design. Finite Element Analysis (FEA) solvers, such as Ansys Maxwell and COMSOL Multiphysics, are popular tools to obtain accurate electric field information. However, these solvers are computationally expensive and time intensive. In this paper, a simple and accurate DBC model is developed. Schwarz-Christoffel Transformations are used to obtain an analytical formula to evaluate the electric field in the DBC model. The analytical models are verified against FEA models designed in Ansys Maxwell. The analytical method provides accurate electric field values while significantly reducing computation time.
| Original language | English |
|---|---|
| Pages (from-to) | 342-350 |
| Number of pages | 9 |
| Journal | IEEE Open Journal of Power Electronics |
| Volume | 7 |
| DOIs | |
| State | Published - 2026 |
Keywords
- Partial discharge
- Schwarz–Christoffel transformation
- direct-bonded copper
- power module
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