Low temperature biochemically compatible bonding technique using fluoropolymers for biochemical microfluidic systems

Arum Han; Kwang W. Oh; Shekhar Bhansali; H. Thurman Henderson; Chong H. Ahn

Low temperature biochemically compatible bonding technique using fluoropolymers for biochemical microfluidic systems

Arum Han
, Kwang W. Oh
, Shekhar Bhansali
, H. Thurman Henderson
, Chong H. Ahn

Department of Electrical Engineering

University of Cincinnati

Research output: Contribution to conference › Paper › peer-review

33 Scopus citations

Abstract

A new low temperature biochemically compatible bonding technique using fluoropolymers has been developed in this work and characterized in terms of mechanical bonding strength and biochemical resistance. This bonding technique uses a spin-on Teflon-like amorphous fluorocarbon polymer (CYTOP^TM) as a bonding interface layer. The developed bonding process requires a bonding temperature of 160 °C and the bonding strength attained from the process shows 4.3 Mpa in silicon-to-silicon. Furthermore, the bonding technique achieves reliable and leak-proof bonding in various substrates and provides excellent chemical resistance and biocompatibility for some specific immunoassays. The bonding technique developed in this work has been successfully applied to the development of a microfluidic motherboard system with surface mountable microfluidic components.

Original language	English
Pages	414-418
Number of pages	5
State	Published - 2000
Event	13th Annual International Conference on Micro Electro Mechanical Systems (MEMS 2000) - Miyazaki, Jpn Duration: Jan 23 2000 → Jan 27 2000

Conference

Conference	13th Annual International Conference on Micro Electro Mechanical Systems (MEMS 2000)
City	Miyazaki, Jpn
Period	01/23/00 → 01/27/00

Cite this

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title = "Low temperature biochemically compatible bonding technique using fluoropolymers for biochemical microfluidic systems",

abstract = "A new low temperature biochemically compatible bonding technique using fluoropolymers has been developed in this work and characterized in terms of mechanical bonding strength and biochemical resistance. This bonding technique uses a spin-on Teflon-like amorphous fluorocarbon polymer (CYTOPTM) as a bonding interface layer. The developed bonding process requires a bonding temperature of 160 °C and the bonding strength attained from the process shows 4.3 Mpa in silicon-to-silicon. Furthermore, the bonding technique achieves reliable and leak-proof bonding in various substrates and provides excellent chemical resistance and biocompatibility for some specific immunoassays. The bonding technique developed in this work has been successfully applied to the development of a microfluidic motherboard system with surface mountable microfluidic components.",

author = "Arum Han and Oh, \{Kwang W.\} and Shekhar Bhansali and Henderson, \{H. Thurman\} and Ahn, \{Chong H.\}",

year = "2000",

language = "English",

pages = "414--418",

note = "13th Annual International Conference on Micro Electro Mechanical Systems (MEMS 2000) ; Conference date: 23-01-2000 Through 27-01-2000",

}

Low temperature biochemically compatible bonding technique using fluoropolymers for biochemical microfluidic systems. / Han, Arum; Oh, Kwang W.; Bhansali, Shekhar et al.
2000. 414-418 Paper presented at 13th Annual International Conference on Micro Electro Mechanical Systems (MEMS 2000), Miyazaki, Jpn.

Research output: Contribution to conference › Paper › peer-review

TY - CONF

T1 - Low temperature biochemically compatible bonding technique using fluoropolymers for biochemical microfluidic systems

AU - Han, Arum

AU - Oh, Kwang W.

AU - Bhansali, Shekhar

AU - Henderson, H. Thurman

AU - Ahn, Chong H.

PY - 2000

Y1 - 2000

N2 - A new low temperature biochemically compatible bonding technique using fluoropolymers has been developed in this work and characterized in terms of mechanical bonding strength and biochemical resistance. This bonding technique uses a spin-on Teflon-like amorphous fluorocarbon polymer (CYTOPTM) as a bonding interface layer. The developed bonding process requires a bonding temperature of 160 °C and the bonding strength attained from the process shows 4.3 Mpa in silicon-to-silicon. Furthermore, the bonding technique achieves reliable and leak-proof bonding in various substrates and provides excellent chemical resistance and biocompatibility for some specific immunoassays. The bonding technique developed in this work has been successfully applied to the development of a microfluidic motherboard system with surface mountable microfluidic components.

AB - A new low temperature biochemically compatible bonding technique using fluoropolymers has been developed in this work and characterized in terms of mechanical bonding strength and biochemical resistance. This bonding technique uses a spin-on Teflon-like amorphous fluorocarbon polymer (CYTOPTM) as a bonding interface layer. The developed bonding process requires a bonding temperature of 160 °C and the bonding strength attained from the process shows 4.3 Mpa in silicon-to-silicon. Furthermore, the bonding technique achieves reliable and leak-proof bonding in various substrates and provides excellent chemical resistance and biocompatibility for some specific immunoassays. The bonding technique developed in this work has been successfully applied to the development of a microfluidic motherboard system with surface mountable microfluidic components.

UR - https://www.scopus.com/pages/publications/0033721565

M3 - Paper

AN - SCOPUS:0033721565

SP - 414

EP - 418

T2 - 13th Annual International Conference on Micro Electro Mechanical Systems (MEMS 2000)

Y2 - 23 January 2000 through 27 January 2000

ER -

Low temperature biochemically compatible bonding technique using fluoropolymers for biochemical microfluidic systems

Abstract

Conference

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