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Kinematics analysis of in-parallel 5 DOF haptic device

  • Leng Feng Lee
  • , Madusudanan S. Narayanan
  • , Frank Mendel
  • , Venkat N. Krovi
  • , Paul Karam
  • SUNY Buffalo
  • University of Montreal

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

14 Scopus citations

Abstract

Parallel-architecture haptic devices offer significant advantages over serial-architecture counterparts in applications requiring high stiffness and high accuracy. To this end, many haptic devices have been created and deployed by modularly piecing together several serial-chain arms to form an in-parallel system. However, the overall system performance depends both on the nature of the individual arms as well as their interactions. We build on the rich theoretical background of constrained articulated mechanical systems to provide a systematic framework for formulation of system-level kinematic performance from individual-arm characteristics. Specifically, we develop the system-level kinematic model in a symbolic (yet algorithmic) fashion that facilitates: (i) computational development of pertinent symbolic equations; (ii) generalization to arbitrary architectures; and (iii) combined symbolic/numeric analyses of performance (workspace, singularities, design sensitivities). These various aspects are illustrated using the example of the Quanser High Definition Haptic Device (HD)2 - an in-parallel haptic device formed by coupling two 3-link Phantom 1.5 type serial chain manipulators with appropriate passive joints. We also briefly discuss aspects of ongoing work for design-prototyping and validation, taking advantage of tools from Virtual Prototyping and Hardware-in-the-Loop testing.

Original languageEnglish
Title of host publication2010 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2010
Pages237-241
Number of pages5
DOIs
StatePublished - 2010
Event2010 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2010 - Montreal, QC, Canada
Duration: Jul 6 2010Jul 9 2010

Publication series

NameIEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM

Conference

Conference2010 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2010
Country/TerritoryCanada
CityMontreal, QC
Period07/6/1007/9/10

Keywords

  • Haptic device
  • Kinematics
  • Modeling

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