@inproceedings{47aeabf2f69c4ddeba235e607764f546,
title = "Iron-copper nitride thin films fabricated by sputtering",
abstract = "Iron nitride thin films have unique magnetic properties and wide applications, and copper nitride may have its potential applications in the electronics devices. In this work, iron-copper nitride thin films were fabricated by sputtering techniques. The film thickness varied from 70 nm to 160 nni depending on the deposition parameters such as power source, magnitude of applied power, deposition time and nitrogen/argon flowrates. Materials properties were characterized by scanning electron microscopy (SEM), x-ray diffraction (XRD), x-ray reflectivity (XRR), x-ray photoelectron spectroscopy (XPS) and vibration sample magnetometer (VSM). The effect of copper nitride on the magnetic properties of FeN thin films is observed.",
author = "Xingwu Wang and Parry, \{James P.\} and Hrishikesh Kamat and Ruikun Pan and Hao Zeng",
note = "Publisher Copyright: {\textcopyright} 2016 by The American Ceramic Society.; Developments in Strategic Ceramic Materials - 39th International Conference on Advanced Ceramics and Composites, ICACC 2015 ; Conference date: 25-01-2015 Through 30-01-2015",
year = "2016",
language = "English",
isbn = "9781119040439",
series = "Ceramic Engineering and Science Proceedings",
publisher = "American Ceramic Society",
number = "8",
pages = "239--250",
editor = "Dongming Zhu and Thomas Fischer and Jingyang Wang and Kriven, \{Waltraud M.\}",
booktitle = "Developments in Strategic Ceramic Materials - A Collection of Papers Presented at the 39th International Conference on Advanced Ceramics and Composites",
address = "United States",
edition = "8",
}