TY - GEN
T1 - Investigation of control and applications of modular multilevel converter with sub-modular series IGBTs
AU - Yue, Lu
AU - Yao, Xiu
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/4/18
Y1 - 2018/4/18
N2 - Modular Multilevel Converter (MMC) has been an attractive option for power transmission and has been studied and used for HVDC applications. However, it still has limitations when the number of Sub-Modules per arm is large. To avoid the limitations and exploit the advantages, a method is proposed in this paper which integrates an MMC with series-connected IGBTs in each Sub-Module (SM). The proposed MMC is able to withstand a higher voltage with devices of lower voltage ratings. The series-connected IGBTs are self-balancing. Simulink and real-time simulations both show that, with the proposed method, series IGBTs are able to share a much higher MMC sub-module voltage and recover from voltage imbalances in a timely manner. The proposed series IGBT balancing method causes considerably less loss compared to RCD snubber circuit-based balancing methods.
AB - Modular Multilevel Converter (MMC) has been an attractive option for power transmission and has been studied and used for HVDC applications. However, it still has limitations when the number of Sub-Modules per arm is large. To avoid the limitations and exploit the advantages, a method is proposed in this paper which integrates an MMC with series-connected IGBTs in each Sub-Module (SM). The proposed MMC is able to withstand a higher voltage with devices of lower voltage ratings. The series-connected IGBTs are self-balancing. Simulink and real-time simulations both show that, with the proposed method, series IGBTs are able to share a much higher MMC sub-module voltage and recover from voltage imbalances in a timely manner. The proposed series IGBT balancing method causes considerably less loss compared to RCD snubber circuit-based balancing methods.
UR - https://www.scopus.com/pages/publications/85046951124
U2 - 10.1109/APEC.2018.8341213
DO - 10.1109/APEC.2018.8341213
M3 - Conference contribution
AN - SCOPUS:85046951124
T3 - Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
SP - 1486
EP - 1491
BT - APEC 2018 - 33rd Annual IEEE Applied Power Electronics Conference and Exposition
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 33rd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2018
Y2 - 4 March 2018 through 8 March 2018
ER -