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Inverse Design of FinFET SRAM Cells

  • Rui Zhang
  • , Zhaocheng Liu
  • , Kexin Yang
  • , Taizhi Liu
  • , Wenshan Cai
  • , Linda Milor
  • Georgia Institute of Technology

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

A convenient method based on deep neural networks and an evolutionary algorithm is proposed for the inverse design of FinFET SRAM cells. Inverse design helps designers who have less device physics knowledge obtain cell configurations that provide the desired performance metrics under selected wearout conditions, such as a set specific stress time and use scenario that creates a specific activity level (duty cycle and transition rate). The cell configurations being considered consists of various process parameters, such as gate length and fin height, in the presence of variations due to process and wearout. The front-end mechanisms related to wearout include negative bias temperature instability (NBTI), hot carrier injection (HCI), and random telegraph noise (RTN). The process of inverse design is achieved quickly and at good accuracy.

Original languageEnglish
Title of host publication2020 IEEE International Reliability Physics Symposium, IRPS 2020 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728131993
DOIs
StatePublished - Apr 2020
Event2020 IEEE International Reliability Physics Symposium, IRPS 2020 - Virtual, Online, United States
Duration: Apr 28 2020May 30 2020

Publication series

NameIEEE International Reliability Physics Symposium Proceedings
Volume2020-April
ISSN (Print)1541-7026

Conference

Conference2020 IEEE International Reliability Physics Symposium, IRPS 2020
Country/TerritoryUnited States
CityVirtual, Online
Period04/28/2005/30/20

Keywords

  • FinFET
  • HCI
  • Inverse Design
  • NBTI
  • Performance Metrics
  • RTN
  • SRAM
  • Wearout Mechanisms

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