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Intra-die process parameter variation and leakage analysis of cache at the microarchitectural level

  • SUNY Buffalo

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

As technology scales down to the nanometer domain, leakage currents begin to contribute significantly to the total power consumption of the chip. In addition, it becomes increasingly difficuilt to control the transistor device parameters. This causes increased heat dissipation in the chip and the degradation in the frequency of operation, thus compromising the reliability of the chip. Hence, it becomes necessary to model the leakage currents and variabilities observed in minimum geometry transistors early in the design flow, to be able to design a low-power, dense and robust cache architecture. In this paper, we present CacheSim, a cache memory simulator that includes compact models for both intra-die process parameter variations and leakage currents in the conventional cache architecture, to give an accurate estimate of memory power at the system level, and the cache access time.

Original languageEnglish
Title of host publicationProceedings - 20th Anniversary IEEE International SOC Conference
Pages79-82
Number of pages4
DOIs
StatePublished - 2007
Event20th Anniversary IEEE International SOC Conference - Hsinchu, Taiwan, Province of China
Duration: Sep 26 2007Sep 29 2007

Publication series

NameProceedings - 20th Anniversary IEEE International SOC Conference

Conference

Conference20th Anniversary IEEE International SOC Conference
Country/TerritoryTaiwan, Province of China
CityHsinchu
Period09/26/0709/29/07

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