TY - GEN
T1 - Intra-die process parameter variation and leakage analysis of cache at the microarchitectural level
AU - Agarwal, Manjari
AU - Elakkumanan, Praveen
AU - Sridhar, Ramalingam
PY - 2007
Y1 - 2007
N2 - As technology scales down to the nanometer domain, leakage currents begin to contribute significantly to the total power consumption of the chip. In addition, it becomes increasingly difficuilt to control the transistor device parameters. This causes increased heat dissipation in the chip and the degradation in the frequency of operation, thus compromising the reliability of the chip. Hence, it becomes necessary to model the leakage currents and variabilities observed in minimum geometry transistors early in the design flow, to be able to design a low-power, dense and robust cache architecture. In this paper, we present CacheSim, a cache memory simulator that includes compact models for both intra-die process parameter variations and leakage currents in the conventional cache architecture, to give an accurate estimate of memory power at the system level, and the cache access time.
AB - As technology scales down to the nanometer domain, leakage currents begin to contribute significantly to the total power consumption of the chip. In addition, it becomes increasingly difficuilt to control the transistor device parameters. This causes increased heat dissipation in the chip and the degradation in the frequency of operation, thus compromising the reliability of the chip. Hence, it becomes necessary to model the leakage currents and variabilities observed in minimum geometry transistors early in the design flow, to be able to design a low-power, dense and robust cache architecture. In this paper, we present CacheSim, a cache memory simulator that includes compact models for both intra-die process parameter variations and leakage currents in the conventional cache architecture, to give an accurate estimate of memory power at the system level, and the cache access time.
UR - https://www.scopus.com/pages/publications/51049112869
U2 - 10.1109/SOCC.2007.4545431
DO - 10.1109/SOCC.2007.4545431
M3 - Conference contribution
AN - SCOPUS:51049112869
SN - 9781424415922
T3 - Proceedings - 20th Anniversary IEEE International SOC Conference
SP - 79
EP - 82
BT - Proceedings - 20th Anniversary IEEE International SOC Conference
T2 - 20th Anniversary IEEE International SOC Conference
Y2 - 26 September 2007 through 29 September 2007
ER -