Abstract
Interfacial roughness parameters and lattice strain of Si 0.4Ge0.6 films with varying thickness epitaxially grown on Si(100) were determined using the techniques of grazing-incidence x-ray scattering and diffraction. The roughness of both the buried interface and sample surface follows a similar power-law scaling behavior with an exponent β around 0.71 for films below the critical thickness, and it undergoes a large change above the critical thickness. Observation of such a scaling law thus establishes a quantitative correlation between the interfacial roughness and lattice strain, and also allows the prediction of interfacial roughness as a function of film thickness of this compound.
| Original language | English |
|---|---|
| Pages (from-to) | 623 |
| Number of pages | 1 |
| Journal | Applied Physics Letters |
| Volume | 67 |
| State | Published - 1994 |
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