Abstract
We report Al2O3In0.53Ga0.47 As MOSFETs having both self-aligned in situ Mo source/drain ohmic contacts and self-aligned InAs source/drain n+ regions formed by MBE regrowth. The device epitaxial dimensions are small, as is required for 22-nm gate length MOSFETs; a 5-nm In0.53 Ga0.47As channel with an In0.48Al0.52As back confinement layer and the n++ source/drain junctions do not extend below the 5-nm channel. A device with 200-nm gate length showed ID = 0.95 mA}/μm current density at VGS = 4.0 V and gm = 0.45 mS/μm peak transconductance at VDS = 2.0 V.
| Original language | English |
|---|---|
| Pages (from-to) | 1128-1130 |
| Number of pages | 3 |
| Journal | IEEE Electron Device Letters |
| Volume | 30 |
| Issue number | 11 |
| DOIs | |
| State | Published - 2009 |
Keywords
- III-V MOSFET
- InAs source/drain
- InGaAs MOSFET
- Migration-enhanced epitaxial regrowth
- Source/drain regrowth
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