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In0.53Ga0.47As Channel MOSFETs with self-aligned InAs source/drain formed by MEE regrowth

  • Uttam Singisetti
  • , Mark A. Wistey
  • , Gregory J. Burek
  • , Ashish K. Baraskar
  • , Brian J. Thibeault
  • , Arthur C. Gossard
  • , Mark J.W. Rodwell
  • , Byungha Shin
  • , Eun J. Kim
  • , Paul C. McIntyre
  • , Bo Yu
  • , Yu Yuan
  • , Dennis Wang
  • , Yuan Taur
  • , Pater Asbeck
  • , Yong Ju Lee
  • University of California at Santa Barbara
  • Stanford University
  • University of California at San Diego
  • Intel

Research output: Contribution to journalArticlepeer-review

84 Scopus citations

Abstract

We report Al2O3In0.53Ga0.47 As MOSFETs having both self-aligned in situ Mo source/drain ohmic contacts and self-aligned InAs source/drain n+ regions formed by MBE regrowth. The device epitaxial dimensions are small, as is required for 22-nm gate length MOSFETs; a 5-nm In0.53 Ga0.47As channel with an In0.48Al0.52As back confinement layer and the n++ source/drain junctions do not extend below the 5-nm channel. A device with 200-nm gate length showed ID = 0.95 mA}/μm current density at VGS = 4.0 V and gm = 0.45 mS/μm peak transconductance at VDS = 2.0 V.

Original languageEnglish
Pages (from-to)1128-1130
Number of pages3
JournalIEEE Electron Device Letters
Volume30
Issue number11
DOIs
StatePublished - 2009

Keywords

  • III-V MOSFET
  • InAs source/drain
  • InGaAs MOSFET
  • Migration-enhanced epitaxial regrowth
  • Source/drain regrowth

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