Abstract
The influence of microstructure coarsening on thermomechanical fatigue behavior of eutectic solder joint is investigated by numerical simulation. A phase growth model is selected based on the experimental observation and incorporated in a damage mechanics based viscoplastic constitutive model. Comparisons between the simulations with and without coarsening effect are made for isothermal, cyclic shear testing and thermal cycling of solder joints in BGA electronic packaging.
| Original language | English |
|---|---|
| Pages (from-to) | 235-255 |
| Number of pages | 21 |
| Journal | International Journal of Damage Mechanics |
| Volume | 10 |
| Issue number | 3 |
| DOIs | |
| State | Published - Jul 2001 |
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