Abstract
By in situ X-ray diffraction, we have obtained direct evidence for the distinction in melting temperature between the first and subsequent heating in ∼ 1000 Å gold contacts to GaAs. During the first heating, melting occurred at 456-500°C and is attributed to the melting of a reaction product tentively identified as the orthorhombic AuGa compound (50 at.% Ga), which formed in the solid state. The minimum temperature required for the solid-state reaction and the melting temperature decreased with decreasing hydrostatic pressure. During second and subsequent heating, melting occurred at 410-415°C and is attributed to the melting of β AuGa (or Au7Ga2), which formed after the first melting-solidification cycle. At high cooling rates (e.g. 40°C/min) during the first solidification, β was observed together with a phase (tentative Au2Ga) which increased in proportion with increasing cooling rate.
| Original language | English |
|---|---|
| Pages (from-to) | 339-345 |
| Number of pages | 7 |
| Journal | Solid State Electronics |
| Volume | 27 |
| Issue number | 4 |
| DOIs | |
| State | Published - Apr 1984 |
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