High-definition conductive silver patterns on polyimide film: Via an ion exchange plating method

In this work, we developed a new ion exchange plating (IEP) method that is different to traditional electrochemical plating or electroless plating techniques. A variety of silver patterns were prepared by using the IEP technique as demonstrated in this work. The key factors to the definition and the conductive performance of silver patterns were systematically studied. Mechanisms of the formation of the conductive silver patterns was studied as well. A new model was established for elucidating the deposition process. Importantly, using this IEP method coupled with mask technology, double-sided interconnected conductive silver patterns on polyimide substrates were successfully fabricated with high definition. This new technology will provide a unique capability to fabricate double-sided or multi-sided interconnection for next generation printed circuit board (PCB).