Heat conduction for Riemannian foliations

Seiki Nishikawa; Mohan Ramachandran; Philippe Tondeur

doi:10.1090/S0273-0979-1989-15826-6

Heat conduction for Riemannian foliations

Seiki Nishikawa
, Mohan Ramachandran
, Philippe Tondeur

Mathematics

Kyushu University
Ohio State University
University of Illinois at Urbana-Champaign

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

Original language	English
Pages (from-to)	265-267
Number of pages	3
Journal	Bulletin of the American Mathematical Society
Volume	21
Issue number	2
DOIs	https://doi.org/10.1090/S0273-0979-1989-15826-6
State	Published - Oct 1989

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10.1090/S0273-0979-1989-15826-6

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@article{2ff9266e5ec04e58abc8d1ecc082299d,

title = "Heat conduction for Riemannian foliations",

author = "Seiki Nishikawa and Mohan Ramachandran and Philippe Tondeur",

year = "1989",

month = oct,

doi = "10.1090/S0273-0979-1989-15826-6",

language = "English",

volume = "21",

pages = "265--267",

journal = "Bulletin of the American Mathematical Society",

issn = "0273-0979",

publisher = "American Mathematical Society",

number = "2",

}

TY - JOUR

T1 - Heat conduction for Riemannian foliations

AU - Nishikawa, Seiki

AU - Ramachandran, Mohan

AU - Tondeur, Philippe

PY - 1989/10

Y1 - 1989/10

UR - https://www.scopus.com/pages/publications/84968466511

U2 - 10.1090/S0273-0979-1989-15826-6

DO - 10.1090/S0273-0979-1989-15826-6

M3 - Article

AN - SCOPUS:84968466511

SN - 0273-0979

VL - 21

SP - 265

EP - 267

JO - Bulletin of the American Mathematical Society

JF - Bulletin of the American Mathematical Society

IS - 2

ER -

Heat conduction for Riemannian foliations

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