@inproceedings{1866f7650ca24c309f7a9c9b4f0189db,
title = "Grain growth in eutectic Pb/Sn ball grid array solder joints",
abstract = "The reliability of solder joints in electronic packaging is becoming more important as Ball Grid Array (BGA) develops rapidly into the most popular packaging technology. Thermal fatigue of solder joints has been a reliability concern in the electronic packaging industry since the introduction of surface mount technology (SMT). Micro-structural coarsening (grain growth) is considered to be closely related to thermomechanical fatigue failure. Many researchers proposed coarsening models for bulk scale metals. But these models have never been verified for micron scale actual BGA solder balls. In the present study, three different grain growth models are investigated experimentally on BGA solder balls in a real life electronic package. Model simulations obtained from three models were compared against test data. The best performing model was chosen for finite element fatigue reliability studies based on continuum damage mechanics.",
keywords = "Electronic packaging thermal management, Electronics industry, Electronics packaging, Fatigue, Finite element methods, Soldering, Surface-mount technology, Testing, Thermomechanical processes, Tin",
author = "C. Basaran and Yujun Wen",
note = "Publisher Copyright: {\textcopyright} 2002 IEEE.; 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 ; Conference date: 30-05-2002 Through 01-06-2002",
year = "2002",
doi = "10.1109/ITHERM.2002.1012551",
language = "English",
series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",
publisher = "IEEE Computer Society",
pages = "903--908",
editor = "Sammakia, \{Bahgat G.\} and Joshi, \{Yogendra K.\} and Ganesh Subbarayan and Amon, \{Cristina H.\} and Koneru Ramakrishna and Sathe, \{Sanjeev B.\}",
booktitle = "ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems",
address = "United States",
}