Flip chip and BGA solder joint reliability

Hua Ye; Cemal Basaran; Doug Hopkins; Heng Liu; Alexander Cartwright

Flip chip and BGA solder joint reliability

Hua Ye
, Cemal Basaran
, Doug Hopkins
, Heng Liu
, Alexander Cartwright

Department of Civil, Structural & Environmental Engineering

SUNY Buffalo

Research output: Contribution to specialist publication › Article

Abstract

Flip chip and ball grid array (BGA) solder joint reliability are discussed. A constitutive model is proposed to predict the strain-stress evolution of solder joints under current stressing. Moire experiments on BGA solder joints and microstructural tests on flip chip solder joints are conducted. Finite-element simulations are implemented to predict solder ball reliability under current stressing.

Original language	English
Pages	17-19
Number of pages	3
Volume	12
No	5
Specialist publication	Advanced Packaging
State	Published - May 2003

Cite this

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title = "Flip chip and BGA solder joint reliability",

abstract = "Flip chip and ball grid array (BGA) solder joint reliability are discussed. A constitutive model is proposed to predict the strain-stress evolution of solder joints under current stressing. Moire experiments on BGA solder joints and microstructural tests on flip chip solder joints are conducted. Finite-element simulations are implemented to predict solder ball reliability under current stressing.",

author = "Hua Ye and Cemal Basaran and Doug Hopkins and Heng Liu and Alexander Cartwright",

year = "2003",

month = may,

language = "English",

volume = "12",

pages = "17--19",

journal = "Advanced Packaging",

issn = "1065-0555",

publisher = "PennWell Corp.",

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TY - GEN

T1 - Flip chip and BGA solder joint reliability

AU - Ye, Hua

AU - Basaran, Cemal

AU - Hopkins, Doug

AU - Liu, Heng

AU - Cartwright, Alexander

PY - 2003/5

Y1 - 2003/5

N2 - Flip chip and ball grid array (BGA) solder joint reliability are discussed. A constitutive model is proposed to predict the strain-stress evolution of solder joints under current stressing. Moire experiments on BGA solder joints and microstructural tests on flip chip solder joints are conducted. Finite-element simulations are implemented to predict solder ball reliability under current stressing.

AB - Flip chip and ball grid array (BGA) solder joint reliability are discussed. A constitutive model is proposed to predict the strain-stress evolution of solder joints under current stressing. Moire experiments on BGA solder joints and microstructural tests on flip chip solder joints are conducted. Finite-element simulations are implemented to predict solder ball reliability under current stressing.

UR - https://www.scopus.com/pages/publications/0037644669

M3 - Article

AN - SCOPUS:0037644669

SN - 1065-0555

VL - 12

SP - 17

EP - 19

JO - Advanced Packaging

JF - Advanced Packaging

ER -

Flip chip and BGA solder joint reliability

Abstract

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